• Micro/Nano Fabrication - Imaging Facilities

        DRY ETCHING FACILITY : Focused Ion Beam | Electron Beam
        WET ETCHING (Photolithography) FACILITY:
           - Mask Aligner
           - Wire bonder
           - Twin Chamber Thermal Evaporator
           - Profilometer
           - 2 wet benches
        SEM - EDS - AFM
         
  • DRY ETCHING FACILITY

    Focused Ion Beam | Electron Beam (Versa 3D FIB-SEM/EDS Dual Beam and Raith Electron Beam)

    • The high-current Focused Ion Beam (FIB) enables fast material removal and low voltage clean-up for low-damage surface finishing in high vacuum mode. Gas chemistries are available for depositing materials or enhancing FIB milling rate or selectivity. Nonconductive samples are easily milled with the automated Drift Suppression milling mode. With Versa 3D the choice is yours to optimize the system for conductive samples in high vacuum; non-conductive samples with low vacuum.

      Typical Applications of Dual Beam Microscopes

      Site Specific Cross Section Analyses: This technique is typically suited for volumes up to 100 × 100 µm cross section areas. .

      Micro and Nanostructuring: dual beam microscopes  (DBM)  are often equipped with Gas Injection Systems  (GIS)  to introduce different functional precursors which allows then for the fabrication of (functional) micro- and nanostructures. Basically, one can divide this maskless direct write methods in two main classes.

      Versa 3D FIB-SEM (Dual-Beam™) system is also equipped with Raith E-Beam Lithography for making complex patterns and structures at nano scale.

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    WET ETCHING FACILITY

    Mask Aligner (SUSS MFB4)

    MATERIAL: From materials to 100mm round and square substrates

    EXPOSURE MODES: CONTACT, SOFT, HARD, VACUUM, SOFT VACUUM

    OPTICS: UV300 % UV400

    SPLITTED MICRPSCOPE with CCD camera

     

     

    Wire bonder (KULICKE SOFFA)

    Wire bonder is a ball bonder with 0.19, 0.25 and 0.5 micron gold wires.

     

     

     

     

     

     

    Twin Chamber Thermal Evaporator (VAKSIS)

    The evaporator has twin chamber for enabling metallization process seperately for n- and p-tyep semicondcutors. Every chamber has 3 electrodes.

     

     

     

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    Profilometer (KLA Tencor P6 )

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    Wet benches

    Twin wetbenches, 2 meter long each, includes ultrasonic cleaner, spin coater, hot plates.

     

    IMAGING FACILITY

    AFM (Park System)

    AFM has Non-Contact ve Tapping Mod Atomic Force, Lateral Force ve  Force Distance Spectroscopy, Electric Force Microscopy, Nanolithography, Nanoindentation, Scanning Tunneling Microscopy ve Phase Imaging modes.

     

     

     

                 


    SEM IMAGING (FEI)

    SEM is a componenet of FEI Focused Ion Beam syatem. The resolution is 1.2 nm @ 30kV. EDAX detectors is also installed for component analysis